Manufacturing method of electronic component
US7752747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2004 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Jan 25, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.