Vapor compression circuit and method including a thermoelectric device
US7752852B2 · kind B2 · utility
22Cited by
226References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2006 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Sep 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02A40/963
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A system and method includes a thermoelectric device in heat-transfer relation with a working fluid flowing through a vapor compression circuit. Heat is transferred from the working fluid to a first fluid medium and then from the first fluid medium to a second fluid medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.