Heat dissipation device
US7753106B2 · kind B2 · utility
7Cited by
7References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 16, 2006 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | May 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat conducting member (10) adapted for contacting with a heat generating electronic device and a fin unit (30). The fin unit defines a central hole (300) therein and consists of a plurality of fins (31) around the central hole and clasping each other. The fin unit fits around a periphery of the heat conducting member via the heat conducting member extending in the central hole of the fin unit. A clip (40) engages with the heat conducting member and the fin unit for providing a pressure to the fin unit such that the fin unit is intimately fastened to the heat conducting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.