Dispensing device and mounting system
US7753253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2006 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Feb 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.