Patent · US Active

Cleaning device for cleaning process gas of a reflow soldering system

US7753997B2 · kind B2 · utility

0Cited by

34References

15Claims

0Family size

Assignee

REHM THERMAL SYSTEMS GMBH · DE

Inventors

Hartmut Meier · Schkeuditz, DE
Bernd Muller · Spicheren, FR
Ulrich Wittreich · Velten, DE

Key dates

Filing date	Sep 26, 2003
Grant date	Jul 13, 2010
Priority date	—
Expiry date	Feb 19, 2027

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K1/012
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

The present invention is directed to a cleaning device for process gases of a reflow soldering system that includes a plurality of cleaning chambers. The plurality of cleaning chambers contain a cleaning liquid for the process gas, where each of the cleaning chambers is adapted to be flown through via a supply line for the contaminated process gas and via a discharge line for the cleaned gas. The cleaning chambers also include a plurality of cleaning walls along which the cleaning liquid is flown for take-up of impurities in the process gas into the cleaning liquid. A plurality of the deposition walls is provided, where at least one of the deposition walls also forms an outer wall of the cleaning device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.