Multilayer card of thermoplastic material and a method of making the multilayer card secure
US7754311B2 · kind B2 · utility
0Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 2, 2004 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Feb 22, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24868
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a multilayer card of thermoplastic material comprising first and second layers (7, 2) secured to each other, together with least one reinforced bonding zone (9) between the first layer and the second layer. The invention also provides a method of making a multilayer card secure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.