Process for producing resist pattern and conductor pattern
US7754416B2 · kind B2 · utility
1Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2005 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Mar 14, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0317
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This process for producing a resist pattern includes: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type positive photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to said photoresist laminate, and the step of developing said (c) photoresist layer together with said (b) inorganic substance layer to form a resist pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.