Printed circuits and method for making same
US7754417B2 · kind B2 · utility
3Cited by
5References
15Claims
0Family size
Inventor
Key dates
| Filing date | May 21, 2007 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Aug 6, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.