Patent · US Active

Structure having strong contact with solid particles, substrate having strong contact with solid particles, and manufacturing methods thereof

US7754649B2 · kind B2 · utility

0Cited by
2References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 27, 2007
Grant dateJul 13, 2010
Priority date
Expiry dateMar 27, 2027

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF01N2370/00
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

A structure having strong contact with solid particles comprising an assembly formed by secondary aggregation which is further aggregation of aggregates each formed by primary aggregation of primary particles each made of a metal and/or a metal oxide, wherein an average primary particle diameter of the primary particles is in a range from 1 to 100 μm, and, among void pores formed by the aggregates, a volume of void pores having pore diameters in a range within ±50% away from an average void pore diameter of the void pores is equal to or above 60% of a total volume of the void pores.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.