Adhesion promoter
US7754812B2 · kind B2 · utility
3Cited by
31References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2007 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Mar 17, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesion promoter for a hot melt adhesive or a pressure sensitive adhesive prepared by admixing a hydrolytic silane compound with an aqueous buffer solution. The adhesive is able to bind at very low surface free energy substrates, such as Xerographic prints contaminated by silicone fuser oil. The hot melt adhesive maintains a substantially stable viscosity at temperature ranging from about 100° C. to about 200° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.