Patent · US Expired

Compact circuit carrier package

US7754976B2 · kind B2 · utility

1Cited by

72References

9Claims

0Family size

Assignee

Hamilton Sundstrand Corporation (HSC) · US

Inventors

Ralf Greiner · Gräfenhainichen, DE
Josef Maier · Eichstätt, DE
Kai Paintner · Welden, DE
Richard Sinning · Schnelldorf, DE

Key dates

Filing date	Apr 15, 2002
Grant date	Jul 13, 2010
Priority date	—
Expiry date	Jan 16, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/049
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A circuit carrier assembly includes a plurality of substrates directly secured together by an electrically conductive securing substance. In one example, the securing substance is a conductive epoxy. In another example, the electrically conductive securing substance is solder. Still another example includes a combination of solder and conductive epoxy. A non-conductive epoxy provides further mechanical connection and thermal conductivity between the substrates while also electrically isolating selected portions of the substrates in one example. The electrically conductive securing substance not only mechanically secures the substrates together and provides thermal conductivity between the substrates, which increases the thermal capacitance of the assembly, but also establishes at least one electrically conductive path between the substrates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.