Solder-bearing wafer for use in soldering operations
US7754979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2006 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Aug 17, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, an electrical connector for electrical connection to a second electronic device having at least one second contact includes a substrate having a first surface and an opposing second surface, with a recess being formed in the first surface. The connect also has a first contact securely coupled to the substrate and having a first portion extending at least partially into the recess and a mass of solder material retainingly held in the recess such that the first portion of the first contact is in contact with the solder material. The first surface is for placement against the second electronic device such that the first and second contacts are aligned and whereupon heating of the mass of solder material, the first and second contacts are securely attached to one another and form an electrical pathway therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.