Liquid metal thermal interface material system
US7755184B2 · kind B2 · utility
20Cited by
6References
64Claims
0Family size
Inventors
Key dates
| Filing date | Dec 8, 2006 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Feb 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3651
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.