Intelligent packaging method and system based on acoustic wave devices
US7755489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2008 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Feb 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6406
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An intelligent packaging system utilizing acoustic wave devices includes an electronic module, a SAW ID, various passive SAW sensors and a printed antenna. The passive SAW sensors include a SAW pressure sensor, a SAW temperature sensor and one or more SAW chemical sensors for monitoring physical parameters of a package content. The electronic module generally includes a printed large area distributed electrical circuit, an impedance transformer and a SAW transponder for realizing passive wireless monitoring of the structural integrity of the package. A separate power harvesting antenna and/or a separate dual band antenna can generate radio frequency (RF) power for biasing components associated with the electronic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.