Architecture for business process integration

US7756751B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Tsz S. Cheng · Grand Prairie, US
• Ying Huang · Yorktown Heights, US
• Santhosh Kumaran · Peekskill, US
• Amaresh Rajasekharan · Somers, US
• Mathews Thomas · Flower Mound, US
• Frederick Y. Wu · Greenwich, US
• Yiming Ye · Duluth, US

Key dates

• Filing date: Nov 17, 2003
• Grant date: Jul 13, 2010
• Expiry date: Nov 25, 2028

Classification

• Technology area (CPC G): Physics
• CPC primary: G06Q40/04
• WIPO field: IT methods for management
• WIPO sector: Electrical engineering

Abstract

A software architecture can include an artifact layer and a configuration layer. The artifact layer can contain multiple application independent artifacts. A configuration layer can contain at least one application. The application can include multiple states in which the application executes instructions. The states can exist within execution spaces that are distributed across a network. The application uses artifacts of the artifact layer, which can operate in a state dependent manner.