Support system for semiconductor wafers
US7757363B2 · kind B2 · utility
2Cited by
16References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2006 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Apr 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53961
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.