Method of manufacturing an ultrasonic probe
US7757389B2 · kind B2 · utility
2Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2007 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | May 9, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
For providing a flexible printed circuit board in which the distance between each of plural wiring patterns is a desired distance by cutting the flexible printed circuit board having plural wiring patterns, plural wiring patterns are formed so as to extend on the surface of an electrically insulative base film, and each of the plural wiring patterns is formed so as to include a portion where the distance between each of them is narrowed along the extending direction of the base film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.