Manufacturing method for packaging electronic products in a band-shaped package
US7757464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2005 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Mar 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0084
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.