Apparatus for forming a circuit
US7757631B2 · kind B2 · utility
4Cited by
13References
88Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2004 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Feb 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses for forming components or circuits by ejecting a fluid including materials in a single ligament are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.