System, method and apparatus for lapping workpieces with soluble abrasives
US7758403B2 · kind B2 · utility
1Cited by
12References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2007 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Dec 24, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soluble abrasive is used to lap workpieces to overcome the problem of embedding and retaining abrasive particles in the workpieces. The soluble abrasives are dissolved from the workpiece even if they become embedded in the workpiece. For example, the abrasives may be dissolved with water and comprise ionic salts. The soluble abrasive has a hardness that is equal to or slightly greater than the hardness of the metal being lapped.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.