Method and apparatus for applying a voltage to a substrate during plating
US7758732B1 · kind B1 · utility
71Cited by
47References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2009 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Feb 13, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set of parallel mandrels. (The substrates are held in a mutually parallel orientation, typically vertically, during plating.) A voltage is applied to the substrates via a contact pin, a contact plate, a set of ball bearings, a rack end-plate, and the mandrels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.