Microelectronic security coatings
US7758911B2 · kind B2 · utility
8Cited by
12References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 8, 2003 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Apr 28, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249955
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.