Method for producing layers located on a hybrid circuit
US7759261B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2004 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Dec 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for obtaining layers defined on a hybrid circuit. The hybrid circuit including a substrate and at least one elementary circuit that includes a first facet and a second facet, being hybridized via the second facet to a facet of the substrate. This facet of the substrate and each elementary circuit are coated with a first layer, the first layer is removed from the first facet of the elementary circuit, the first facet and the subsisting part of the first layer are coated with a second layer, and the subsisting part and the second layer covering it are removed. Such a method may, for example, find application to obtaining an antireflection or metal layer on a chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.