Emulsion containing epoxy resin
US7759432B2 · kind B2 · utility
2Cited by
20References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2005 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Nov 7, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2367/02
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The emulsion herein is of an epoxy resin having a glass transition temperature of at least about 40° C., wherein the average diameter of the epoxy resin particles in the emulsion is 500 nm or less. The emulsion may include an epoxy resin, a sulfonated polyester resin and a nonionic surfactant. The emulsion may be used to produce a toner particle in an emulsion aggregation method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.