Thin key sheet and production method thereof
US7759594B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2006 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Feb 27, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2229/05
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Preparing a resin film having a transparency and a thickness of 0.2 mm or less such as PC, PET, PU or the like; drawing the resin film in such a manner to form concave portions at positions corresponding to a plurality of the key tops of the resin film by pinching the resin film between heating drawing dies; forming a pressing element on the undersurface of the film by filling a filler (resin) into the concave portion formed by means of the drawing; and disposing the key tops by means of adhesion, the key tops formed on the top surface of the resin film by means of the resin formation, the mold printing or the like after the formation of the pressing elements, which achieves further thinner configuration of the key sheet with the configuration that the key tops and the pressing elements are disposed, respectively on the top surface and the undersurface of the resin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.