Method for high-precision fixing of a miniaturized component on a support plate
US7759604B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2006 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | May 19, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/31
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for high-precision fixing of a miniaturized component (1), in particular having a microoptical element (2), on a predetermined fixing section (3) of a support plate (4) by a solder joint. The support plate is formed throughout from a metallic material and has a cut-out region (10) which encloses the fixing section (3), is bridged by at least one connecting web (9) of the support plate (4), keeps the heat transfer from the fixing section (3) to the remaining support plate low and compensates lateral thermal expansions of the fixing section (3). Solder material (8) is applied on the top of the fixing section (3). The method comprises in particular the steps: arrangement of the component (1) above the fixing section (3), the solder material (8) and the base (7) of the component (1) being present in opposite positions without contact and forming a space. Supply of electromagnetic radiation (12) to the bottom (6) of the fixing section (3) for melting the solder material (8′) so that, as a result of drop formation and optionally as a result of lowering of the component (1) the space fills with molten solder material (8′) for mutual fixing. Waiting for th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.