Liquid cooling system
US7760500B2 · kind B2 · utility
2Cited by
31References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2008 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Oct 8, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.