Heat dissipation apparatus
US7760501B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 7, 2008 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Nov 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus includes a heat sink (30) and a fan (50) mounted on the heat sink. The heat sink includes a plurality of radial fins (311, 331). An air channel (312, 332) is defined between every two adjacent fins. Each of the fins includes a main body (331, 331) and an airflow guiding flange (314, 334) extending upwardly and outwardly from a top side of the main body. The airflow guiding flange is twisted in a radial direction, such that an included angle between the airflow guiding flange and the main body is gradually increased from an outer side (318, 338) towards an inner side (317, 337) of the main body. The fan is used to generate airflow towards the heat sink. The airflow is guided into the air channels between the fins via the airflow guiding flanges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.