Patent · US Active

Power semiconductor module

US7760505B2 · kind B2 · utility

1Cited by

1References

18Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Markus Meier · Aarau, CH
Bertrand Viala · Karlsruhe, DE
Stephan Jonas · Gerlingen, DE

Key dates

Filing date	Feb 4, 2008
Grant date	Jul 20, 2010
Priority date	—
Expiry date	Sep 10, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power semiconductor module is disclosed, including a plate-type substrate fitted with at least one component, and a base plate provided for dissipating heat from the component via the substrate. In at least one embodiment, a supporting apparatus, which keeps the substrate in thermal contact with the base plate, has a central pressure bolt adjoined by a plurality of stamps which extend in different directions and are intended to contact-connect the substrate, the individual stamps being at non-uniform distances from the substrate in the mechanically unloaded state of the pressure bolt.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.