Patent · US Active

Enhanced power distribution in an integrated circuit

US7760578B2 · kind B2 · utility

6Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 20, 2008
Grant dateJul 20, 2010
Priority date
Expiry dateJan 31, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3011
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

An integrated circuit structure for distributing power to one or more standard cells in an integrated circuit includes a first plurality of standard cells and a power mesh power connection structure coupled to the cells. Each of the standard cells includes first and second power rails adapted for connection to a voltage supply and a voltage return, respectively, of the standard cells. Each standard cell in a subset of the standard cells is arranged in direct abutment with at least two other standard cells, and at least first and second end cells are arranged in direct abutment with at least one other standard cell of the first plurality of standard cells. The power mesh power connection structure includes a plurality of conductive elements formed in a plurality of different conductive layers in the integrated circuit. The power mesh power connection structure is operative to connect the first and second power rails of the first plurality of standard cells to the voltage supply and voltage return, respectively, and is configured so as to reduce a first voltage differential between respective first power rails of the standard cells and to reduce a second voltage differential between …

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.