Method and apparatus for bond management according to hierarchy
US7760631B2 · kind B2 · utility
1Cited by
15References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 11, 2008 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Oct 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L47/125
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
In a communication system having a plurality of physical communication ports, a hierarchical bond communication interface has a logical interface as a component of the bond at a top level of the hierarchy, and a first subjugate logical interface at a second level of the hierarchy as a component of the top-level logical interface. The communication system has a control mechanism whereby thresholds may be set to determine up or down status of hierarchical bonds for use in communication, according to characteristics of components of the bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.