Multi-function module
US7762818B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 29, 2008 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Jan 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.