Polishing pad and cushion layer for polishing pad
US7762870B2 · kind B2 · utility
35Cited by
35References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2006 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Mar 2, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad includes a polishing layer having abrasive grains dispersed in a resin and is characterized in that the resin is a resin containing ionic groups in the range of 20 to 1500 eq/ton.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.