Laser facet pre-coating etch for controlling leakage current
US7763485B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2007 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Apr 16, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/34306
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for etching facets of a laser die prior to coating in such a way as to control the formation of oxides and metallic films on the facet is disclosed. In one embodiment, the method includes placing a wafer on which the laser is included in the interior volume of an etching chamber. Nitrogen is introduced into the interior volume to define a nitrogen-rich environment. The laser facet is then etched in the nitrogen-rich environment with argon delivered from an ion gun. In another embodiment, the method includes placing the laser in an ion beam etching chamber, then physically etching the facet of the laser with an ion beam that includes an argon/nitrogen mixture. The laser facet(s) can then be coated as desired. The etching method reduces the incidence of leakage current during operation of the laser die caused by metallic film formation on the facet before coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.