Wafer-level packaging of micro devices
US7763962B2 · kind B2 · utility
2Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2006 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Oct 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An encapsulated device includes a micro device on a substrate, a cover bonded to the substrate thereby forming a chamber to encapsulate the micro device, and a desiccant material on the cover and in the chamber. An anti-stiction material is absorbed in the desiccant material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.