Structure with semiconductor chips embeded therein
US7763969B2 · kind B2 · utility
59Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2006 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Sep 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embedded semiconductor chip structure and a method for fabricating the same are proposed. The structure comprises: a carrier board, therewith a plurality of through openings formed in the carrier board, and through trenches surrounding the through openings in the same; a plurality of semiconductor chips received in the through openings of the carrier board. Subsequently, cutting is processed via the through trenches. Thus, the space usage of the circuit board and the layout design are more efficient. Moreover, shaping time is also shortened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.