Stacked package structure for reducing package volume of an acoustic micro-sensor
US7763972B2 · kind B2 · utility
6Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2008 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Jan 20, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2410/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stacked package structure utilizes flip-chip technology to stack an acoustic micro-sensor on an integrated circuit (IC) device having a recess as a back chamber and cover the acoustic micro-sensor using a glass substrate or a planar substrate with an aperture. With the use of the stacked package structure, the package volume of the acoustic micro-sensor can be reduced effectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.