Substrate stage and heat treatment apparatus
US7764355B2 · kind B2 · utility
2Cited by
0References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 18, 2007 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Mar 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stage body has a holding surface for placing a substrate thereon. A predetermined embossed configuration is formed by embossing on the holding surface, and thereafter an alumina film in an amorphous state is formed by an anodic oxidation process on the holding surface. The alumina film having an amorphous structure is dense and strong to provide high wear resistance and to substantially prevent separation electrification. This provides a substrate stage having high wear resistance and capable of preventing separation electrification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.