Electronic system with a heat sink assembly
US7764500B2 · kind B2 · utility
4Cited by
2References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 31, 2007 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Apr 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel perpendicularly connecting with the first panel. The printed circuit board is mounted on the first panel of the enclosure. The heat sink assembly has a first end mounted on the printed circuit board for contacting a heat-generating electronic device on the printed circuit board, and a second end opposite to the first end. The holding member connects the second panel of the enclosure with the second end of the heat sink assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.