Heat transfer system for a receptacle assembly
US7764504B2 · kind B2 · utility
88Cited by
33References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2007 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | May 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/659
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A receptacle assembly includes a housing that is configured to hold an electrical module. An energy transfer element, which is held by the housing, is positioned to directly engage the electrical module. The transfer element absorbs thermal energy produced by the electrical module. The receptacle assembly also includes a heat sink that is remotely located from the transfer element. A thermally conductive member extends between the heat sink and the transfer element to convey thermal energy therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.