Method for improving power distribution current measurement on printed circuit boards
US7765673B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2008 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Jun 24, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and system for improving power distribution and/or current measurement on a printed circuit board is disclosed. According to the invention, a first power plane adapted for current measurement includes a first segment to which a current source is connected and a second segment to which other devices may be connected, forming the current load. A third segment is used to measure the current between the first segment and the second segment through two vias that link two points of the third segment to, preferably, two pads of the external layer. In a preferred embodiment, vias are connected to the first segment so that current flow in the third segment is linear, to improve and simplify current determination. The resistivity between the pair of vias may be computed or estimated using calibrated currents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.