Multilayer wiring structure and method of manufacturing the same
US7765686B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2006 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Dec 19, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a multilayer wiring structure is disclosed. The method comprises a step of forming a via post on a first metal wiring element, a step of printing an interlayer insulation film on the first metal wiring element, with use of a screen mask having a non-ejection area slightly larger than a head of the via post, such that the interlayer insulation film has an upper surface at the level lower than the head of the via post, while generally aligning the non-ejection area with the head of the via post, a step of curing the interlayer insulation film, and a step of forming a second metal wiring element in contact with the via post on the interlayer insulation film such that the first metal wiring element and the second metal wiring element are connected through the via post.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.