Process for fabricating electronic components and electronic components obtained by this process
US7765690B2 · kind B2 · utility
0Cited by
4References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2005 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Oct 29, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/496
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method for producing electronic components consisting in carrying out a first anodization of a carrier material (1) for forming at least one first pore (3) extending in a first direction in said carrier material (1) and in carrying out a second anodization for forming at least one second pore (17) extending in the carrier material (1) in a second direction different from the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.