Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits
US7765811B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2007 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Oct 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/13
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In one exemplary embodiment, an assembly includes one or more thermoelectric modules, a compliant thermal interface, and a heat spreader. The compliant thermal interface is configured such that it may substantially conform against and intimately thermally contact an outer surface of a fluid conduit. The heat spreader is disposed generally between and thermally coupled to the compliant thermal interface and the one or more thermoelectric modules. The heat spreader may have greater flexibility than the one or more thermoelectric modules. The heat spreader may also have a thermal conductivity greater than the compliant thermal interface. The assembly may have sufficient flexibility to be circumferentially wrapped at least partially around a portion of the fluid conduit's outer surface, with the compliant thermal interface in substantial conformance against and in intimate thermal contact with the fluid conduit's outer surface portion. Accordingly, a thermally-conducting heat path may thus be established from the fluid conduit to the one or more thermoelectric modules via the compliant thermal interface and the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.