Heat-dissipating device having air-guiding structure
US7766074B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 12, 2006 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Jun 3, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-dissipating device having an air-guiding structure includes a heat-conducting seat, a fin assembly, at least one heat pipe for serially connecting to the fin assembly and the heat-conducting seat, and a fan assembly unit. The fin assembly is positioned above the heat-conducting seat and formed by arranging a plurality of heat-dissipating fins at intervals. As a result, airflow paths are formed between each heat-dissipating fin. The fan assembly unit is laterally provided at one side of the fin assembly. A space for lateral flow is formed between the heat-conducting seat and the fin assembly. The other side of the fin assembly is provided with an air-guiding member. The air-guiding member has a guiding space for laterally communicating with the space. The air blown by the fan assembly unit can pass through the space and is received by the air-guiding member. Then, the air flow is guided to the portions to be heat-dissipated by the air-guiding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.