Flexible adhesive materials for micro-fluid ejection heads and methods relating thereto
US7766455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2006 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Jun 3, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1601
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.