Patent · US Active

Laminating roller assembly, credential substrate laminator and method of laminating a credential substrate

US7767050B2 · kind B2 · utility

14Cited by

21References

17Claims

0Family size

Assignee

HID Global Corp. · DE

Inventors

James R. Meier · Windom, US
Greg E. Gindele · Maple Lake, US
Gan Zhao · Beijing, CN
Anthony L. Lokken · Golden Valley, US
Chadwick M. Johnson · Savage, US
Matthew K. Dunham · Eagan, US

Key dates

Filing date	Mar 26, 2007
Grant date	Aug 3, 2010
Priority date	—
Expiry date	Feb 22, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1741
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A laminating roller assembly comprises a frame, a movable support supported by the frame, a laminating roller and a lift mechanism. The laminating roller is attached to the movable support. The lift mechanism is attached to the frame and is configured to move the movable support and the attached laminating roller relative to the frame. Additional embodiments of the invention are directed to a credential substrate laminator and a method of laminating a credential substrate using a credential substrate laminator.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.