Device and method for electrolytically treating an at least superficially electrically conducting work piece

US7767065B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Reinhard Schneider · Cadolzburg, DE
• Stephan Kenny · Berlin, DE
• Torsten Küssner · Berlin, DE
• Wolfgang Plöse · Neuruppin, DE
• Bert Reents · Berlin, DE
• Heribert Streup · Berlin, DE

Key dates

• Filing date: Aug 28, 2003
• Grant date: Aug 3, 2010
• Expiry date: Nov 29, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/241
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.