Positive type resist composition, process for forming resist pattern, and process for performing ion implantation
US7767377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2005 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Dec 6, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention is a positive type resist composition comprising a resin component (A) for use in a resist, having alkali solubility which increases under the action of an acid, an acid generator component (B) which generates an acid upon being exposed, and an organic solvent which dissolves the resin component (A) and the acid generator component (B), wherein the resin component (A) contains the resin component (A1) for use in a resist having alkali solubility which increases under the action of an acid having the following structural units (a1), (a2) and (a3): (in formula (1), R represents a hydrogen atom or a lower alkyl group, R11represents acid-dissociable, dissolution-inhibiting groups consisting of chain tertiary alkyl groups),
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.