Auto routing for optimal uniformity control
US7767471B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2007 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Feb 25, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for improving within-wafer uniformity is provided. The method includes forming an electrical component by a first process step and a second process step, wherein the electrical component has a target electrical parameter. The method includes providing a first plurality of production tools for performing the first process step; providing a second plurality of production tools for performing the second process step; providing a wafer; performing the first process step on the wafer using one of the first plurality of production tools; and selecting a first route including a first production tool from the second plurality of production tools. A within-wafer uniformity of the target electrical parameter on the wafer manufactured by the first route is greater than a second route including a second production tool in the second plurality of production tools.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.